Electrical Thermal Co simulation of 3 D IC Structures Using Celsius Thermal Solver

This prerecorded webinar explains the forces driving electronics designers to utilize advanced 3D packaging methods and shows an analysis of a System on Integrated Chips (SoIC) design. Temperature profiles are plotted for thermal, electrothermal, and transient behaviors using the Celsius Thermal Solver. Find more great content from Cadence: Subscribe to our YouTube channel: Connect with Cadence: Website: Facebook: