20 W Fiber Laser IC Decapsulation

I could have run this on an even lower power but it would have taken longer. The components don t seem to be damaged anyway. The laser can effectively remove the black encapsulation of any IC, even if the component is not completely in focus. (The second component on the video was 5mm tall which is much larger than the depth of focus. ) If it is known where the semiconductor components is, it can be excluded from the process. Very effective way to do failure analysis on failed components.